SEMIKRON IGBT SKKD260/16 SKKD380/16

Main Product Series – Function & Application Comparison

Typical Applications & Industries:
✓ AC inverter drives and motor control ✓ Solar inverters and energy storage systems
✓ UPS and power supplies ✓ EV/HEV traction inverters
✓ Welding and induction heating ✓ Public transport and wind power

Detailed Description – SEMIKRON IGBT Module Portfolio

1. SEMITRANS® Classic – Industry Standard Workhorse

The SEMITRANS Classic line represents the most well-established IGBT power module design in the industry. With a huge portfolio from 600V to 1700V, it covers robust high-current IGBT chipsets as well as the latest fast-switching types. Multiple source IGBTs, CAL diodes, and SiC MOSFETs are configured in half-bridge circuits and their variants .

Key Features:

• ✓ Industry-standard 62mm (SEMITRANS 3) and 34mm (SEMITRANS 2) housings 

• ✓ Baseplate with screw terminals (power) and plug terminals (auxiliary)

• ✓ Multiple source chipsets in Si and SiC

• ✓ Topologies: half-bridge, buck, boost, single, and common emitter

Applications: Motor drives, solar and energy storage, UPS, green hydrogen, power supplies .

Example Model: SKM800GB12M7 – 800A, 1200V half-bridge module with IGBT M7 chip technology, fast/soft switching CAL7 diodes, DBC copper baseplate, UL recognized .

2. SEMiX® – Compact, Solder-Free Design

SEMiX modules feature new SPT+ (Soft-Punch-Through) chip technology based on a planar-gate/punch-through IGBT design. Benefits include lower switching losses, positive temperature coefficient, and high switching frequency capability .

Key Features:

• ✓ 17mm uniform height for compact, flat inverter designs

• ✓ Spring contacts for solder-free control PCB connection 

• ✓ Low-inductance design with AC/DC terminals at opposite ends

• ✓ Pre-applied PCM options (HP-PCM λ=8.5 W/mK or HALA HT λ=3.0 W/mK) for improved thermal interface 

Topologies: Half-bridge, six-pack, chopper .

Applications: AC/DC drives (15–110kW), UPS, renewable energy systems .

Example Models:

• SEMiX753GB17E7Dp-M07 – 750A, 1700V, half-bridge, IGBT T7, HP-PCM 

• SEMiX223GB17E7p-M06 – 225A, 1700V, half-bridge, IGBT T7, HALA HT 

3. MiniSKiiP® – Pressure Contact Technology

MiniSKiiP modules are highly integrated power modules featuring pressure contact technology – no soldering required. Over 15 million MiniSKiiP modules are currently in use worldwide .

Key Features:

• ✓ Pressure contact technology – solder-free, highly reliable 

• ✓ Rugged design – optimized current density, matched materials for high power cycling capability

• ✓ CIB & six-pack topologies – converter + inverter + brake integrated

• ✓ Four package sizes, 8A to 200A, 600V/1200V 

Applications: Standard drives up to 37kW motor power, frequency converters .

Example Models (MiniSKiiP 0): SKIIP02NAC066V3 (10A, 600V), SKIIP03NAC126V1 (8A, 1200V) – three-phase bridges with NTC thermistor .

4. SKiM® – Automotive-Grade Sinter Technology

SKiM modules are built specifically for automotive applications. The chips are sintered, creating a thin silver layer with superior thermal resistance and increased service life compared to soldered joints .

Key Features:

• ✓ Sinter technology – high power cycling capability

• ✓ Shock and vibration stability – meets automotive demands 

• ✓ Direct driver assembly – eliminates noise on gate wires

• ✓ Compact, flat, low-inductance design

Applications: EV/HEV traction inverters, automotive power systems .

Ratings: 200–600A, 650V/1200V/1700V .

5. SEMITOP® – PCB-Mount Compact Modules

SEMITOP modules are designed for applications where thermal management, high reliability, and cost are critical. Compact design with rugged pin terminals for solder contact to PCB .

Key Features:

• ✓ Pin terminals – solder to PCB

• ✓ Pressure technology + single mounting screw – lower Rth(j-s) than TO packages 

• ✓ Mechanical stress-free design – superior power cycling capability

• ✓ 10A to 200A, 600V/1200V 

Applications: Inverters, switched-mode power supplies, UPS, double PFC, DC servo drives .

Key Technology Features Across SEMIKRON Portfolio

Selection Guide – Understanding the Naming Convention (SEMIKRON IGBT Modules)

SEMIKRON part numbers follow a structured logic that encodes key specifications .

Example 1: SKM100GB123D

Topology Decoder:

Voltage Decoder:

Generation Decoder:

Example 2: SKM800GB12M7 → 800A, 1200V, half-bridge, M7 chip technology .

Example 3: SEMiX753GB17E7Dp-M07 → SEMiX line, 753A, 1700V, half-bridge, IGBT T7, HP-PCM